Open AccessCo‐design of micro‐fluidic heat sink and thermal through‐silicon‐vias for cooling of three‐dimensional integrated circuit
Author(s) -
Shi Bing,
Srivastava Ankur,
BarCohen Avram
Publication year - 2013
Publication title -
iet circuits, devices and systems
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.251
H-Index - 49
ISSN - 1751-8598
DOI - 10.1049/iet-cds.2013.0026
Subject(s) - computer cooling , heat sink , coolant , materials science , thermal conduction , three dimensional integrated circuit , thermal conductivity , thermal , thermal resistance , active cooling , mechanical engineering , electronics cooling , water cooling , optoelectronics , integrated circuit , electronic engineering , thermal management of electronic devices and systems , engineering , composite material , thermodynamics , physics
Three‐dimensional integrated circuits (3D‐ICs) bring about new challenges to chip thermal management because of their high heat densities. Micro‐channel‐based liquid cooling and thermal through‐silicon‐vias (TSVs) have been adopted to alleviate the thermal issues in 3D‐ICs. Thermal TSV enables higher interlayer thermal conductivity thereby achieving a more uniform thermal profile. Although somewhat effective in reducing temperatures, they are limited by the nature of the heat sink. On the other hand, micro‐channel‐based liquid cooling is significantly capable of addressing 3D‐IC cooling needs, but consumes a lot of extra power for pumping coolant through channels. This study proposes a hybrid 3D‐IC cooling scheme which combines micro‐channel liquid cooling and thermal TSV with one acting as heat removal agent, whereas the other enabling beneficial heat conduction paths to the micro‐channel structures. The experimental results show that the proposed hybrid cooling scheme provides much better cooling capability than using only thermal TSVs, although consuming 56% less cooling power compared with pure micro‐channel cooling.