Open AccessEnhanced thermal conductivity of epoxy composites with core‐shell SiC@SiO 2 nanowires
Author(s) -
Shen Dianyu,
Wang Mengjie,
Wu Yuming,
Liu Zhiduo,
Cao Yong,
Wang Ting,
Wu Xinfeng,
Shi Qingtang,
Chee Kuan W.A.,
Dai Wen,
Bai Hua,
Dai Dan,
Lyu Jilei,
Jiang Nan,
Lin ChengTe,
Yu Jinhong
Publication year - 2017
Publication title -
high voltage
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.732
H-Index - 20
ISSN - 2397-7264
DOI - 10.1049/hve.2017.0041
Subject(s) - epoxy , materials science , composite material , thermal conductivity , composite number , nanowire , thermal expansion , thermal stability , nanotechnology , chemical engineering , engineering
Electronic packaging materials and thermal interface materials (TIMs) are widely used in thermal management. In this study, the epoxy composites with core‐shell structure SiC@SiO 2 nanowires (SiC@SiO 2 NWs) as fillers could effectively enhance the thermal conductivity of epoxy composites. The unique structure of fillers results in a high thermal conductivity of epoxy composites, which is attributed to good interfacial compatibility epoxy matrix and bridging connections of SiC@SiO 2 NWs. From neat epoxy to 2.5 wt% loading of SiC@SiO 2 NWs, the thermal conductivity is significantly increased from 0.218 to 0.391 W m −1 K −1 , increased by 79.4%. In addition, the composite with 2.5 wt% filler possess lower coefficient of thermal expansion and better thermal stability than that of neat epoxy. All these outstanding properties imply that epoxy/SiC@SiO 2 NWs composites could be the ideal candidate for TIM.