Open AccessFlex‐circuit resonant chip with Y5V multilayer capacitor for wireless temperature tracking
Author(s) -
Patel Ronish,
Selvaraj Madeshwaran,
Takahata Kenichi
Publication year - 2022
Publication title -
electronics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.375
H-Index - 146
eISSN - 1350-911X
pISSN - 0013-5194
DOI - 10.1049/ell2.12448
Subject(s) - capacitor , flex , wireless , chip , temperature measurement , materials science , electrical engineering , tracking (education) , electronic engineering , optoelectronics , voltage , computer science , engineering , telecommunications , physics , psychology , pedagogy , quantum mechanics
This paper reports the first wireless thermometric device enabled using a surface‐mount capacitor microchip as the sensing element, offering a low‐cost, disposable, and flexible sensor potentially suitable for a wide range of application areas. The device is developed in the form of a resonant‐circuit chip, in which a Y5V‐type multilayer capacitor microchip that exhibits significant temperature dependence serves as a thermoresponsive element that varies the resonant frequency of the circuit upon a temperature change. The wireless sensor chips prototyped in conjunction with the flex‐circuit technology are tested to show their intended function with the frequency responses of up to 129 kHz/°C for ambient temperature variations. Wireless temperature tracking of a fluid‐flowing channel is experimentally demonstrated using the prototype.