Open AccessSwitching power supply EMC optimisation design method
Author(s) -
Yin Wanjun,
Ming ZhengFeng,
Wen Tao
Publication year - 2020
Publication title -
electronics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.375
H-Index - 146
eISSN - 1350-911X
pISSN - 0013-5194
DOI - 10.1049/el.2020.1086
Subject(s) - emi , electromagnetic interference , capacitance , parasitic capacitance , heat sink , electromagnetic compatibility , transistor , conducted electromagnetic interference , electronic engineering , electrical engineering , electrical impedance , permittivity , finite element method , parasitic element , materials science , engineering , voltage , physics , dielectric , structural engineering , electrode , quantum mechanics
On the basis of serious electromagnetic interference (EMI) produced by power electronic equipment, parasitic capacitance existing between transistor and heat sink is considered as the main factor disturbing common‐mode loop. Calculation model of parasitic capacitance is established by using finite element method and electrostatic field principle, and computing method is also derived. EMI improvement method for converter system is proposed by controlling the parasitic capacitance impedance. Experimental results show that changing the permittivity and thickness of the thermal conductive adhesive which are filled between the transistor heat‐conducting plate and heat sink to can reduce the conducted interference.