Open AccessVCSEL pumped VECSEL concept with compact design
Author(s) -
Herper M.,
Lee A.,
Kolb J.,
Gronenborn S.,
Moench H.,
Loosen P.
Publication year - 2019
Publication title -
electronics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.375
H-Index - 146
eISSN - 1350-911X
pISSN - 0013-5194
DOI - 10.1049/el.2019.0574
Subject(s) - vertical cavity surface emitting laser , materials science , optoelectronics , laser , heat sink , semiconductor laser theory , optics , laser beam quality , chip , semiconductor , optical pumping , laser beams , physics , electrical engineering , engineering
The authors present a new compact optically pumped vertical external‐cavity surface‐emitting laser (OP‐VECSEL), which consists of an optically pumped semiconductor chip surrounded by vertical‐cavity surface‐emitting laser (VCSEL) chips mounted together on one heat sink. This configuration allows to reach 10 W optical output power in single‐mode operation with a very compact design. Furthermore, the authors reveal further improvements, which lead to a compact laser module with high power, highest beam quality and potentially low manufacturing costs.