Open Accessbreaking the mould
Publication year - 2018
Publication title -
electronics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.375
H-Index - 146
eISSN - 1350-911X
pISSN - 0013-5194
DOI - 10.1049/el.2018.6620
Subject(s) - shell (structure) , resonator , fabrication , casting , 3d printing , microwave , mechanical engineering , radio frequency , 3d printed , process (computing) , electronic component , component (thermodynamics) , computer science , materials science , engineering , engineering drawing , acoustics , electrical engineering , manufacturing engineering , composite material , telecommunications , physics , medicine , alternative medicine , pathology , thermodynamics , operating system