Open AccessThree‐dimensional high‐isolated dual‐band balun using double‐sided parallel‐strip line with inserted conductor plane
Author(s) -
Yao Lidan,
Wu Yongle,
Li Mingxing,
Liu Yuanan
Publication year - 2017
Publication title -
electronics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.375
H-Index - 146
ISSN - 1350-911X
DOI - 10.1049/el.2017.1954
Subject(s) - balun , conductor , ground plane , resistor , line (geometry) , plane (geometry) , horizontal plane , impedance matching , optics , electrical impedance , physics , electrical engineering , engineering , mathematics , geometry , antenna (radio) , voltage
A novel three‐dimensional high‐isolated dual‐band balun is proposed for the first time. A horizontal feeding plane, a vertically mounted plane, and four grounded resistors constitute the entire structure. By introducing the double‐sided parallel‐strip line with an inserted conductor plane to the middle of the vertical plane, the output matching and isolation, frequency‐independent phase difference, and complete ground in the bottom layer of the horizontal plane are perfectly integrated in this novel balun. To prove this conception, a practical balun operating at 1.3/2.5 GHz is designed. As expected, remarkable consistency between the simulation and measurement is obtained.