Open AccessCompact crossover on multilayer substrate for UWB applications
Author(s) -
Seddiki M.L.,
Ghanem F.,
Nedil M.,
Bouklif A.
Publication year - 2017
Publication title -
electronics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.375
H-Index - 146
eISSN - 1350-911X
pISSN - 0013-5194
DOI - 10.1049/el.2016.3682
Subject(s) - crossover , microstrip , insertion loss , planar , transmission line , materials science , ultra wideband , impedance matching , wideband , electrical impedance , electronic engineering , transmission (telecommunications) , optoelectronics , computer science , telecommunications , engineering , electrical engineering , artificial intelligence , computer graphics (images)
A new design of planar bilayer ultra‐wideband (UWB) crossover is presented. The structure is composed of double slot coupled transitions and a microstrip transmission line to provide a better isolation between the cross‐lines. A good agreement between simulation results and measurements has been achieved. Experimental results show excellent impedance matching of more than 15 dB at the all four ports. A good isolation and insertion loss between the two signal paths of the crossover with more than 25 and 1.3 dB, respectively, over the entire UWB band is observed.