Open AccessExperimental verification and analysis of analytical model of the shape of bond wire antennas
Author(s) -
Ndip I.,
Huhn M.,
Brandenburger F.,
Ehrhardt C.,
SchneiderRamelow M.,
Reichl H.,
Lang K.D.,
Henke H.
Publication year - 2017
Publication title -
electronics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.375
H-Index - 146
ISSN - 1350-911X
DOI - 10.1049/el.2016.3673
Subject(s) - wire bonding , bond , materials science , electronic engineering , computer science , engineering , telecommunications , chip , finance , economics
In this Letter, the authors present the experimental verification of an analytical model, which captures the realistic shape of bond wire antennas (BWAs) in dependence on the wire bonding and design parameters. Using the verified model, the impact of the shape of the wires on the performance of BWAs is quantified.