Open AccessCeramic filled resin based 3D printed X ‐band dual‐mode bandpass filter with enhanced thermal handling capability
Author(s) -
Guo Cheng,
Li Jin,
Dinh Duc D.,
Shang Xiaobang,
Lancaster Michael J.,
Xu Jun
Publication year - 2016
Publication title -
electronics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.375
H-Index - 146
eISSN - 1350-911X
pISSN - 0013-5194
DOI - 10.1049/el.2016.2955
Subject(s) - stereolithography , materials science , ceramic , band pass filter , microwave , filter (signal processing) , resonator , thermal , optoelectronics , waveguide filter , composite material , thermal stability , electronic engineering , low pass filter , electrical engineering , prototype filter , computer science , telecommunications , physics , quantum mechanics , meteorology , engineering
A miniaturised spherical resonator based X ‐band dual‐mode bandpass filter that is 3D printed using a ceramic filled photosensitive resin is the first time presented. This filter has substantially enhanced thermal handling capability than its counterparts that are printed out of the conventional resins with a relatively low working temperature. The filter's thermal handling capability is experimentally characterised by measuring its RF performance under different working temperatures using a pair of tailor made aluminium thermal isolators to separate the network analyser from the heat source. The measured results demonstrate that the ceramic resin based filter is capable of operating at much higher temperatures, and has a much better thermal stability than the one made of ordinary resin, without losing its intrinsic light‐weight advantage over the one made of metal. This type of thermally‐stable ceramic filled resin can be widely applied to stereolithography‐based 3D printed lightweight microwave and millimetre‐wave waveguide devices.