Open AccessMutual coupling reduction between closely spaced microstrip antennas by means of H‐shaped conducting wall
Author(s) -
Park C.H.,
Son H.W.
Publication year - 2016
Publication title -
electronics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.375
H-Index - 146
ISSN - 1350-911X
DOI - 10.1049/el.2016.1339
Subject(s) - ground plane , microstrip , microstrip antenna , bandwidth (computing) , materials science , resonator , enhanced data rates for gsm evolution , patch antenna , coupling (piping) , dielectric , optoelectronics , antenna (radio) , optics , electrical engineering , physics , engineering , telecommunications , composite material
This Letter presents a novel H‐shaped conducting wall structure that effectively suppresses the mutual coupling between two closely spaced microstrip antennas (MSAs). The wall consists of an H‐shaped copper strip printed on a dielectric substrate, and a row of periodic vias through which the strip is connected to a ground plane. The wall is inserted between the MSAs and surrounds half the periphery of each antenna. Measurements of a prototype show that the high isolation of about 51 dB is achieved between two MSAs separated by the edge‐to‐edge distance of 0.052 λ 0 at 5.2 GHz. The proposed structure greatly improves the isolation without causing any significant degradation of the antenna bandwidth, gain, or front‐to‐back ratio, unlike other isolation structures based on resonators or defected ground structures.