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High voltage and high current density vertical GaN power diodes
Author(s) -
Armstrong A.M.,
Allerman A.A.,
Fischer A.J.,
King M.P.,
Heukelom M.S.,
Moseley M.W.,
Kaplar R.J.,
Wierer J.J.,
Crawford M.H.,
Dickerson J.R.
Publication year - 2016
Publication title -
electronics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.375
H-Index - 146
ISSN - 1350-911X
DOI - 10.1049/el.2016.1156
Subject(s) - materials science , optoelectronics , diode , current (fluid) , power (physics) , voltage , electrical engineering , current density , gallium nitride , wide bandgap semiconductor , high voltage , physics , engineering , nanotechnology , layer (electronics) , quantum mechanics
The realisation of a GaN high voltage vertical p – n diode operating at >3.9 kV breakdown with a specific on‐resistance <0.9 mΩ cm 2 is reported. Diodes achieved a forward current of 1 A for on‐wafer, DC measurements, corresponding to a current density >1.4 kA/cm 2 . An effective critical electric field of 3.9 MV/cm was estimated for the devices from analysis of the forward and reverse current–voltage characteristics. This suggests that the fundamental limit to the GaN critical electric field is significantly greater than previously believed.

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