Open AccessFine‐pitch surface component mounting on screen‐printed fabric circuits
Author(s) -
Lin X.,
Seet B.C.,
Joseph F.
Publication year - 2016
Publication title -
electronics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.375
H-Index - 146
ISSN - 1350-911X
DOI - 10.1049/el.2016.1044
Subject(s) - printed circuit board , screen printing , materials science , electrical conductor , inkwell , soldering , electronic circuit , surface mount technology , lead frame , conductive ink , fabrication , electronic component , solder paste , curing (chemistry) , layer (electronics) , composite material , electrical engineering , sheet resistance , engineering , medicine , semiconductor device , alternative medicine , pathology
A novel method of bonding surface mount components to screen‐printed fabric circuits is proposed. The method is achieved by applying the same technique of screen‐printing conductive ink patterns of fabric circuit for printing a layer of low‐temperature solder paste onto uncured conductive ink pads, and placing the circuit with mounted components inside an oven for a one‐step curing process. A screen‐printing frame with 42 μm mesh opening is used for both conductive ink and solder paste layers. Thus, a 0.2 mm resolution for printed traces and spaces is achieved, which meets the demanding geometrical requirements of most integrated circuit chips with fine‐pitch and tiny footprints. Measurement results show the printed tracks after curing exhibit excellent conductivity while retaining good flexibility. Examination under the microscope shows the components are well‐bonded to their on‐fabric pads. The proposed method for surface component mounting and one‐step curing process for screen‐printed fabric circuits can potentially streamline and expedite the twin process of circuit fabrication and component mounting for future smart textile applications.