Influence and mitigation of long differential via stub on signal integrity | Zendy

Wang Jun | Zendy; Lu JianMin | Zendy; Chu XiuQin | Zendy; Liu Yang | Zendy; Lai XinQuan | Zendy; Li YuShan | Zendy

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Influence and mitigation of long differential via stub on signal integrity

Author(s) -

Wang Jun,

Lu JianMin,

Chu XiuQin,

Liu Yang,

Lai XinQuan,

Li YuShan

Publication year - 2015

Publication title -

electronics letters

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.375

H-Index - 146

ISSN - 1350-911X

DOI - 10.1049/el.2015.0823

Subject(s) - signal integrity , stub (electronics) , electronic engineering , materials science , computer science , environmental science , reliability engineering , engineering , electrical engineering , printed circuit board

How the long differential via stub influences the time‐domain response and the eye diagram of the signal trace in a thick multilayer printed circuit board is investigated. Then, it is proved that RL termination has the same efficiency as R and RC terminations on improving signal integrity and the eye diagram. Finally, a method is proposed to mitigate the influence of the via stub by combining mismatched R termination and reflection gain at the receiving end.

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