Open AccessInfluence and mitigation of long differential via stub on signal integrity
Author(s) -
Wang Jun,
Lu JianMin,
Chu XiuQin,
Liu Yang,
Lai XinQuan,
Li YuShan
Publication year - 2015
Publication title -
electronics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.375
H-Index - 146
ISSN - 1350-911X
DOI - 10.1049/el.2015.0823
Subject(s) - signal integrity , stub (electronics) , printed circuit board , electronic engineering , materials science , signal (programming language) , time domain , computer science , acoustics , engineering , electrical engineering , physics , programming language , computer vision
How the long differential via stub influences the time‐domain response and the eye diagram of the signal trace in a thick multilayer printed circuit board is investigated. Then, it is proved that RL termination has the same efficiency as R and RC terminations on improving signal integrity and the eye diagram. Finally, a method is proposed to mitigate the influence of the via stub by combining mismatched R termination and reflection gain at the receiving end.