Open AccessCompact multilayer self‐packaged filter with surface‐mounted packaging
Author(s) -
Ma K.,
Fan L.,
Zhang S.
Publication year - 2015
Publication title -
electronics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.375
H-Index - 146
ISSN - 1350-911X
DOI - 10.1049/el.2014.4129
Subject(s) - insertion loss , stopband , materials science , band pass filter , filter (signal processing) , printed circuit board , bandwidth (computing) , resonator , optoelectronics , electrical impedance , electronic engineering , acoustics , electrical engineering , computer science , telecommunications , engineering , physics
A new self‐packaged bandpass filter by using multilayer print circuit board technology is proposed and investigated. By using a multilayer structure, a lumped step‐impedance resonator as well as self‐packaging, the designed filter can achieve a much more compact size, low insertion loss and a wide stopband. The implemented filter operated at a centre frequency of 800 MHz with a 3 dB bandwidth of 120 MHz demonstrates stopband rejection better than 25 dB up to 4 GHz. The measured insertion loss including the connector loss in the input and output is 1.48 dB. The size of the filter is only 12 × 8 mm, i.e. 0.059 λ g × 0.039 λ g .