Open Accessinterview
Publication year - 2014
Publication title -
electronics letters
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.375
H-Index - 146
eISSN - 1350-911X
pISSN - 0013-5194
DOI - 10.1049/el.2014.2073
Subject(s) - interconnection , three dimensional integrated circuit , stacking , wafer , through silicon via , reliability (semiconductor) , die (integrated circuit) , wire bonding , process integration , integrated circuit , chip , materials science , electronic engineering , electrical engineering , computer science , optoelectronics , engineering , mechanical engineering , power (physics) , telecommunications , process engineering , physics , nuclear magnetic resonance , quantum mechanics