Open AccessCompact flip‐chip interconnection 8 × 50 Gbit/s EADFB laser array module for 400 Gbit/s transceiver
Author(s) -
Kanazawa S.,
Fujisawa T.,
Ohki A.,
Takahata K.,
Sanjoh H.,
Iga R.,
Ishii H.
Publication year - 2014
Publication title -
electronics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.375
H-Index - 146
eISSN - 1350-911X
pISSN - 0013-5194
DOI - 10.1049/el.2013.4276
Subject(s) - multiplexer , transceiver , gigabit , flip chip , interconnection , chip , optoelectronics , laser , materials science , bandwidth (computing) , multiplexing , electronic engineering , optics , electrical engineering , engineering , physics , telecommunications , cmos , adhesive , layer (electronics) , composite material
The first compact electroabsorption modulators integrated with distributed‐feedback (EADFB) laser array module using flip‐chip interconnects have been fabricated for a 400 Gbit/s transceiver. Eight 50 Gbit/s EADFB lasers and an optical multiplexer were monolithically integrated on one chip in an area of only 3.2 × 4.8 mm. The flip‐chip interconnects provide a higher modulation bandwidth. Clear eye opening was achieved for all eight lanes under 50 Gbit/s operation.