Compact flip‐chip interconnection 8 × 50 Gbit/s EADFB laser array module for 400 Gbit/s transceiver | Zendy

Kanazawa S. | Zendy; Fujisawa T. | Zendy; Ohki A. | Zendy; Takahata K. | Zendy; Sanjoh H. | Zendy; Iga R. | Zendy; Ishii H. | Zendy

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Compact flip‐chip interconnection 8 × 50 Gbit/s EADFB laser array module for 400 Gbit/s transceiver

Author(s) -

Kanazawa S.,

Fujisawa T.,

Ohki A.,

Takahata K.,

Sanjoh H.,

Iga R.,

Ishii H.

Publication year - 2014

Publication title -

electronics letters

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.375

H-Index - 146

eISSN - 1350-911X

pISSN - 0013-5194

DOI - 10.1049/el.2013.4276

Subject(s) - gigabit , transceiver , flip chip , interconnection , chip , optoelectronics , materials science , electronic engineering , electrical engineering , computer science , engineering , telecommunications , cmos , layer (electronics) , adhesive , composite material

The first compact electroabsorption modulators integrated with distributed‐feedback (EADFB) laser array module using flip‐chip interconnects have been fabricated for a 400 Gbit/s transceiver. Eight 50 Gbit/s EADFB lasers and an optical multiplexer were monolithically integrated on one chip in an area of only 3.2 × 4.8 mm. The flip‐chip interconnects provide a higher modulation bandwidth. Clear eye opening was achieved for all eight lanes under 50 Gbit/s operation.

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