Ultimate noise isolation in high‐speed digital systems on packages and printed circuit boards | Zendy

Choi J. | Zendy

AI Assistant Blog Pricing

Home ZAIA Blog

Open Access

Ultimate noise isolation in high‐speed digital systems on packages and printed circuit boards

Author(s) -

Choi J.

Publication year - 2013

Publication title -

electronics letters

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.375

H-Index - 146

ISSN - 1350-911X

DOI - 10.1049/el.2012.4303

Subject(s) - printed circuit board , isolation (microbiology) , electrical engineering , electronic engineering , noise (video) , computer science , circuit design , engineering , digital electronics , electronic circuit , microbiology and biotechnology , artificial intelligence , image (mathematics) , biology

A novel idea for ultimate noise isolation in high‐speed digital systems on packages and printed circuit boards (PCBs) is presented. Ultimate noise isolation in high‐speed digital systems on packages and PCBs can be achieved using the following concept: ‘a power island surrounded by a plurality of mixed alternating impedance electromagnetic bandgap (AI‐EBG) structures‐based power distribution network’. In this idea, the gap around the power island provides excellent isolation from DC to the first resonant frequency of the parallel plates in packages or in PCBs and mixed AI‐EBG structures provide excellent isolation from around the first resonant frequency to a substantially infinite frequency. This novel structure is designed, fabricated, and measured, which demonstrates ultimate noise isolation capability in high‐speed digital systems on packages and PCBs.

The content you want is available to Zendy users.

Already have an account? Click here to sign in.

Having issues? You can contact us here

Accelerating Research