Open AccessOn‐chip temperature compensation for optical transmitter modules
Author(s) -
Sangirov J.,
Park T.W.,
Ukaegbu I.A.,
Lee T.W.,
Park H.H.
Publication year - 2013
Publication title -
electronics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.375
H-Index - 146
ISSN - 1350-911X
DOI - 10.1049/el.2012.3350
Subject(s) - transmitter , compensation (psychology) , chip , materials science , optoelectronics , electronic engineering , electrical engineering , engineering , psychology , channel (broadcasting) , psychoanalysis
On‐chip temperature compensation (TC) for optical transmitter (Tx) modules is reported. The TC block is integrated in common silicon (Si)‐substrate with the Tx and demonstrates the ability to maintain a constant VCSEL output light power without an additional monitoring photodiode. Designed and fabricated in a 0.13 µm technology, the Tx with a TC block operates at up to 5 Gbit/s. A BER of less than 10 − 12 is achieved at a received input power of − 3 dBm, with a 1.3 dBm variation of received power for a temperature increase of 20–100°C at 5 Gbit/s data rate. The percentage error of the temperature compensated Tx output light power is ± 3%. The Tx module consumes a power of 20 mW at 1.3 V, including the TC block.