Open AccessOptimized Mid‐bond Order for 3D‐Stacked ICs Considering Failed Bonding
Author(s) -
Liang Huaguo,
Chang Hao,
Li Yang,
Wang Wei,
Chen Tian,
Xu Hui
Publication year - 2015
Publication title -
chinese journal of electronics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.267
H-Index - 25
eISSN - 2075-5597
pISSN - 1022-4653
DOI - 10.1049/cje.2015.04.001
Subject(s) - bond , order (exchange) , materials science , composite material , business , finance
One notable difference between 3D testflow and 2D test flow mainly lies in the mid‐bond test, inwhich the stacking yield can be further enhanced throughoptimized bonding arrangement. In contrast to the existingsequential stacking, this paper proposes a novel rearrangedstacking scheme which estimates the probability and costof failed bonding in each stacking step and optimizes themid‐bond order to screen out the failed component as earlyas possible. The effect of the rearranged stacking has beenextensively analyzed using the yield model and cost modelof 3D‐SICs considering different process parameters suchas die yield, stacking size, failure rate and redundancy degreeof TSVs. Experimental results demonstrate that theproposed rearranged stacking method is only a half of thesequential stacking in terms of Failed area ratio (FAR).