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Photoelastic Investigation of Bimaterial Interfacial Stresses Induced by Thermal Loading
Author(s) -
Wang W.C.,
Lin J.C.
Publication year - 2003
Publication title -
strain
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.477
H-Index - 47
eISSN - 1475-1305
pISSN - 0039-2103
DOI - 10.1046/j.1475-1305.2003.00087.x
Subject(s) - materials science , photoelasticity , thermal , composite material , stress (linguistics) , finite element method , surface (topology) , structural engineering , geometry , engineering , thermodynamics , solid mechanics , mathematics , physics , linguistics , philosophy
In this paper, the photoelastic technique and finite element method were employed to investigate the interfacial stresses induced by thermal loading in bimaterial structures. By observing the photoelastic fringe patterns, in comparison with those theories developed by other investigators, severe temperature and stress gradients were found across the specimens’ heights. The maximum fringe order near the interface was six times that near the top surface of the photoelastic material when the temperature was raised to 65 °C. Furthermore, for the bimaterial structures, differences were found between measured stress fields as a result of increasing and decreasing temperature differences.