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The effect of T ‐stress on plane strain dynamic crack growth in elastic–plastic materials
Author(s) -
JAYADEVAN K. R.,
NARASIMHAN R.,
RAMAMURTHY T. S.,
DATTAGURU B.
Publication year - 2003
Publication title -
fatigue and fracture of engineering materials and structures
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.887
H-Index - 84
eISSN - 1460-2695
pISSN - 8756-758X
DOI - 10.1046/j.1460-2695.2003.00670.x
Subject(s) - materials science , plane stress , fracture toughness , crack tip opening displacement , plasticity , crack closure , crack growth resistance curve , finite element method , strain hardening exponent , isotropy , stress intensity factor , structural engineering , stress (linguistics) , composite material , hardening (computing) , fracture mechanics , mechanics , layer (electronics) , physics , engineering , linguistics , philosophy , quantum mechanics
In this paper, the effects of T ‐stress on steady, dynamic crack growth in an elastic–plastic material are examined using a modified boundary layer formulation. The analyses are carried out under mode I, plane strain conditions by employing a special finite element procedure based on moving crack tip coordinates. The material is assumed to obey the J 2 flow theory of plasticity with isotropic power law hardening. The results show that the crack opening profile as well as the opening stress at a finite distance from the tip are strongly affected by the magnitude and sign of the T ‐stress at any given crack speed. Further, it is found that the fracture toughness predicted by the analyses enhances significantly with negative T ‐stress for both ductile and cleavage mode of crack growth.