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NUMERICAL ANALYSIS OF CRACK PROPAGATION IN PIEZOELECTRIC CERAMICS
Author(s) -
Daining Fang,
Qi Qi,
Xin Yao
Publication year - 1998
Publication title -
fatigue and fracture of engineering materials and structures
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.887
H-Index - 84
eISSN - 1460-2695
pISSN - 8756-758X
DOI - 10.1046/j.1460-2695.1998.00084.x
Subject(s) - piezoelectricity , finite element method , materials science , crack tip opening displacement , fracture mechanics , strain energy release rate , displacement (psychology) , crack closure , electric field , crack growth resistance curve , mechanical load , structural engineering , electric displacement field , mechanics , composite material , engineering , physics , psychology , quantum mechanics , psychotherapist
The formulation of an isoparametric displacement – electric potential finite element method that accounts for the electro‐mechanical coupling effect of piezoelectric materials is briefly presented in this paper. The crack propagation behaviour and the elasto‐electric fields near a crack tip in a PZT‐5 piezoelectric ceramic under mechanical, electrical and mechanical – electrical mixed loads are investigated using this electro‐mechanical finite element method. From the numerical results, it can be seen that crack propagation along the crack plane direction will be impeded and the crack will tend to propagate at an angle of about 84° to the crack plane under a negative electric field on the basis of the maximum stress criterion. The physical explanation of the phenomena is presented in this paper and it is shown that the mechanical strain energy release rate is not a good criterion for predicting crack propagation in the case where the ratio of the electric field to the mechanical load becomes large.