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Adhesive bonding of noble metal alloys with a triazine dithiol derivative primer and an adhesive resin
Author(s) -
Matsumura H.,
Taira Y.,
Atsuta M.
Publication year - 1999
Publication title -
journal of oral rehabilitation
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.991
H-Index - 93
eISSN - 1365-2842
pISSN - 0305-182X
DOI - 10.1046/j.1365-2842.1999.00462.x
Subject(s) - materials science , alloy , bond strength , palladium , adhesive , noble metal , metallurgy , metal , primer (cosmetics) , composite material , chemistry , layer (electronics) , biochemistry , organic chemistry , catalysis
The purpose of this study was to evaluate the bond strength and durability of a metal adhesive system bonded to noble metal alloys. Disc specimens were cast from type IV gold (type IV, Casting Gold M.C.®), metal–ceramic gold (Au–Pt–Pd, Degudent Universal®), metal–ceramic palladium (Pd–Ga–Co, PTM 88®), silver–indium (Ag–In–Zn, Salivan Hard®) and silver–palladium–copper–gold (Ag–Pd–Cu, S12®) alloys and pure silver (pure Ag). The specimens were air‐abraded with 50 μm alumina, conditioned with a thiol‐based primer designed for noble alloys (V‐Primer®), and then bonded with an adhesive resin (Super‐Bond Opaque Ivory®). Shear bond strengths were determined after repeated thermocycling (4–60 °C, 1 min each, 100 000 cycles). The average bond strengths in MPa ( n =8) were 30·9 for the type IV alloy, 29·0 for the Ag–Pd–Cu alloy, 28·0 for the Au–Pt–Pd alloy, 26·3 for the pure Ag, 26·0 for the Pd–Ga–Co alloy and 9·3 for the Ag–In–Zn alloy. The Ag–In–Zn alloy exhibited significantly lower bond strength than the other alloys, whereas the bond strengths of the other four alloys and pure Ag were comparable ( P <0·05). It is concluded that the combined use of the thiol derivative primer and the adhesive resin is effective for bonding the noble metal alloys examined, with the exception of the Ag–In–Zn alloy.