Atomic layer deposition for membrane interface engineering
Author(s) -
HaoCheng Yang,
Ruben Z. Waldman,
Zhaowei Chen,
Seth B. Darling
Publication year - 2018
Publication title -
nanoscale
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.038
H-Index - 224
eISSN - 2040-3372
pISSN - 2040-3364
DOI - 10.1039/c8nr08114j
Subject(s) - atomic layer deposition , layer (electronics) , materials science , deposition (geology) , interface (matter) , membrane , chemical engineering , nanotechnology , composite material , chemistry , engineering , geology , paleontology , biochemistry , sediment , capillary number , capillary action
In many applications, interfaces govern the performance of membranes. Structure, chemistry, electrostatics, and other properties of interfaces can dominate the selectivity, flux, fouling resistance, and other critical aspects of membrane functionality. Control over membrane interfacial properties, therefore, is a powerful means of tailoring performance. In this Minireview, we discuss the application of atomic layer deposition (ALD) and related techniques in the design of novel membrane interfaces. We discuss recent literature in which ALD is used to (1) modify the surface chemistry and interfacial properties of membranes, (2) tailor the pore sizes and separation characteristics of membranes, and (3) enable novel advanced functional membranes.
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