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Leaky wave excitation on three‐dimensional via‐fed printed interconnects
Author(s) -
Hanson George W.,
Yakovlev Alexander B.,
Hutchcraft W. Elliott
Publication year - 2005
Publication title -
radio science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.371
H-Index - 84
eISSN - 1944-799X
pISSN - 0048-6604
DOI - 10.1029/2004rs003168
Subject(s) - excitation , leakage (economics) , microstrip , physics , optics , interconnection , beam (structure) , radiation , materials science , telecommunications , computer science , quantum mechanics , economics , macroeconomics
Leaky wave excitation on three‐dimensional, via‐fed single and coupled microstrip interconnects is studied. Closed‐form asymptotic expressions for the fields associated with the interconnect are derived and are applied in the traveling/standing wave and leaky wave regimes, both of which lead to radiation. The leaky wave beam angle is found to correspond to the usual two‐dimensional ray optics leakage angle for long interconnects, as expected, and depends on interconnect length, spacing, and excitation for shorter interconnects. Comparisons with full‐wave results are shown for the case of via‐fed coupled interconnects.