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A new approach to modeling the cure kinetics of epoxy/amine thermosetting resins. 2. Application to a typical system based on bis[4-(diglycidylamino)phenyl]methane and bis(4-aminophenyl) sulfone
Author(s) -
Kenneth C. Cole,
J.J. Hechler,
D. Noël
Publication year - 1991
Publication title -
macromolecules
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.994
H-Index - 313
eISSN - 1520-5835
pISSN - 0024-9297
DOI - 10.1021/ma00011a012
Subject(s) - thermosetting polymer , sulfone , epoxy , kinetics , amine gas treating , methane , polymer chemistry , materials science , chemistry , organic chemistry , composite material , physics , quantum mechanics

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