Open AccessNetwork Formation and Physical Properties of Epoxy Resins for Future Practical Applications
Author(s) -
Atsuomi Shundo,
Satoru Yamamoto,
Keiji Tanaka
Publication year - 2022
Publication title -
jacs au
Language(s) - English
Resource type - Journals
ISSN - 2691-3704
DOI - 10.1021/jacsau.2c00120
Subject(s) - epoxy , thermosetting polymer , materials science , adhesive , curing (chemistry) , polymer , computer science , composite material , nanotechnology , process engineering , engineering , layer (electronics)
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