Rapid Evaluation of Electron Mobilities at Semiconductor–Insulator Interfaces in an Ambient Atmosphere by a Contactless Microwave-Based Technique
Author(s) -
Junichi Inoue,
Yusuke Tsutsui,
Wookjin Choi,
Kai Kubota,
Tsuneaki Sakurai,
Shu Seki
Publication year - 2017
Publication title -
acs omega
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.779
H-Index - 40
ISSN - 2470-1343
DOI - 10.1021/acsomega.6b00428
Subject(s) - materials science , semiconductor , microwave , electron mobility , dielectric , optoelectronics , organic semiconductor , electron , charge carrier , transistor , insulator (electricity) , nanotechnology , voltage , electrical engineering , telecommunications , computer science , physics , quantum mechanics , engineering
Intrinsic mobility of electrons at the interfaces between crystalline organic semiconductors and insulating dielectric polymer films was rapidly evaluated in an ambient atmosphere by TRMC@ Interfaces , a noncontact and nondestructive method based on dielectric loss spectroscopy of microwaves. By just preparing simple metal-insulator-semiconductor devices, local-scale motions of charge carriers injected into the interface by pulses of gate bias voltage were monitored through reflected microwave changes, resulting in the evaluation of local-scale charge carrier mobilities together with the value of trap density at the interface. The evaluated high electron mobilities of 12 cm 2 V -1 s -1 for N , N '-bis(cyclohexyl)naphthalene-1,4,5,8-bis(dicarboximide) ( DCy-NDI ) and 15 cm 2 V -1 s -1 for N , N '-dioctylperylene-1,4,5,8-bis(dicarboximide) ( DC 8 -PDI ) are the benchmarks for organic semiconducting materials that are comparable with the highest ones reported from the field-effect transistor devices. The present TRMC@ Interfaces was found to serve as a rapid screening technique to examine the intrinsic performance of organic semiconducting materials as well as a useful tool enabling the precise discussion on the relationship among their local-scale charge carrier mobility, thin-film morphology, and packing structure.
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