Open AccessInterfacial Delamination at Multilayer Thin Films in Semiconductor Devices
Author(s) -
JinHoon Kim,
Hye-Jun Kil,
Sangjun Lee,
JinWoo Park
Publication year - 2022
Publication title -
acs omega
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.779
H-Index - 40
ISSN - 2470-1343
DOI - 10.1021/acsomega.2c02122
Subject(s) - materials science , residual stress , delamination (geology) , composite material , thin film , cracking , bending , ultimate tensile strength , stress (linguistics) , residual , nanotechnology , computer science , tectonics , paleontology , linguistics , philosophy , algorithm , biology , subduction
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