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Transmission Electron Microscopy and Electron Energy-Loss Spectroscopy Studies of Hole-Selective Molybdenum Oxide Contacts in Silicon Solar Cells
Author(s) -
Haider Ali,
Céline Maynau,
Luc Lajaunie,
Geoffrey Gregory,
Lijun Wu,
J. P. Looney,
Yimei Zhu,
Matthew M. Schneider,
Winston V. Schoenfeld,
Kristopher O. Davis
Publication year - 2019
Publication title -
acs applied materials and interfaces
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.535
H-Index - 228
eISSN - 1944-8252
pISSN - 1944-8244
DOI - 10.1021/acsami.9b12703
Subject(s) - materials science , electron energy loss spectroscopy , annealing (glass) , work function , transmission electron microscopy , silicon , band bending , scanning transmission electron microscopy , analytical chemistry (journal) , indium tin oxide , indium , thin film , optoelectronics , nanotechnology , layer (electronics) , composite material , chemistry , chromatography
In this study, substochiometric hole-selective molybdenum oxide (MoO x ) contacts in crystalline silicon (c-Si) solar cells were investigated by a combination of transmission electron microscopy (TEM) and spatially resolved electron energy-loss spectroscopy (SR-EELS). It was observed tha a ≈ 4 nm SiO x interlayer grows at the MoO x /c-Si interface during the evaporation of MoO x over a c-Si substrate. SR-EELS analyses revealed the presence of a 1.5 nm diffused MoO x /indium tin oxide (ITO) interface in both as-deposited and annealed samples. Moreover, the presence of a 1 nm thin layer with a lower oxidation state of Mo was detected at the SiO x /MoO x interface in an as-deposited state, which disappears upon annealing. Overall, it was evident that no hole-blocking interlayer is formed at the MoO x /ITO interface during annealing and homogenization of the MoO x layer takes place during the annealing process. Furthermore, device simulations revealed that efficient hole collection is dependent on MoO x work function and that reduction in the work function of MoO x results in loss of band bending and negatively impacts hole selectivity.

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