Open AccessThermal Stability of Copper–Nickel and Copper–Nickel Silicide Contacts for Crystalline Silicon
Author(s) -
Abhijit S. Kale,
William Nemeth,
Craig L. Perkins,
David L. Young,
Alexander Marshall,
Karine Florent,
Santosh Kurinec,
Paul Stradins,
Sumit Agarwal
Publication year - 2018
Publication title -
acs applied energy materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.833
H-Index - 36
ISSN - 2574-0962
DOI - 10.1021/acsaem.8b00488
Subject(s) - materials science , diffusion barrier , copper , nickel , thermal stability , silicide , silicon , barrier layer , layer (electronics) , crystalline silicon , metallurgy , chemical engineering , nanotechnology , engineering
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