Open AccessLow-Temperature Sintering of l -Alanine-Functionalized Metallic Copper Particles Affording Conductive Films with Excellent Oxidative Stability
Author(s) -
H. Jessica Pereira,
C. Elizabeth Killalea,
David B. Amabilino
Publication year - 2022
Publication title -
acs applied electronic materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.379
H-Index - 4
ISSN - 2637-6113
DOI - 10.1021/acsaelm.2c00275
Subject(s) - copper , sintering , ascorbic acid , thermal stability , aqueous solution , reducing agent , materials science , chemical engineering , metal , alanine , inorganic chemistry , chemistry , organic chemistry , composite material , metallurgy , amino acid , biochemistry , food science , engineering
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