Open AccessSelectively Electron-Transparent Microstamping Toward Concurrent Digital Image Correlation and High-Angular Resolution Electron Backscatter Diffraction (EBSD) Analysis
Author(s) -
Timothy Ruggles,
Geoffrey Bomarito,
Andrew Can,
Jacob Hochhalter
Publication year - 2017
Publication title -
microscopy and microanalysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.521
H-Index - 69
eISSN - 1435-8115
pISSN - 1431-9276
DOI - 10.1017/s1431927617012703
Subject(s) - electron backscatter diffraction , digital image correlation , microscale chemistry , materials science , optics , resolution (logic) , angular resolution (graph drawing) , backscatter (email) , diffraction , scanning electron microscope , electron , electron diffraction , physics , computer science , artificial intelligence , mathematics , telecommunications , mathematics education , combinatorics , quantum mechanics , wireless
Digital image correlation (DIC) in a scanning electron microscope and high-angular resolution electron backscatter diffraction (HREBSD) provide valuable and complementary data concerning local deformation at the microscale. However, standard surface preparation techniques are mutually exclusive, which makes combining these techniques in situ impossible. This paper introduces a new method of applying surface patterning for DIC, namely a urethane microstamp, that provides a pattern with enough contrast for DIC at low accelerating voltages, but is virtually transparent at the higher voltages necessary for HREBSD and conventional EBSD analysis. Furthermore, microstamping is inexpensive and repeatable, and is more suitable to the analysis of patterns from complex surface geometries and larger surface areas than other patterning techniques.