Open AccessEffect of filler and application mode on micro-shear bond strength of etch-and-rinse adhesive systems
Author(s) -
Ceci Nunes Carvalho,
Carlos Eduardo Francci,
José Ferreira Costa,
José Bauer
Publication year - 2015
Publication title -
revista portuguesa de estomatologia, medicina dentária e cirurgia maxilofacial
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.144
H-Index - 8
eISSN - 1647-6700
pISSN - 1646-2890
DOI - 10.1016/j.rpemd.2015.05.002
Subject(s) - adhesive , dentin , materials science , composite material , bond strength , enamel paint , rubbing , phosphoric acid , composite number , universal testing machine , shear strength (soil) , ultimate tensile strength , metallurgy , layer (electronics) , environmental science , soil water , soil science
ObjectiveTo evaluate the effect of the application modes and the presence of filler of etch-and-rinse adhesive systems on the micro-shear bond strength test (μSBS) to bovine dentin.MethodsTwenty bovine teeth had the enamel removed and dentin surface exposed. Dentin was etched with 37% phosphoric acid and the following adhesive systems were applied: One Step and One Step Plus with two modes (no rubbing action and vigorous rubbing action). To each tooth six Tygon cylinders with internal 0.76mm were filled with flowable composite resin. All cylinders were light polymerized for 40s (Optilux 501). The μSBS was performed in a universal testing machine (Instron 5565), with specimens held in place by a wire (0.2mm) loop, and force loaded to failure. The fracture mode was evaluated. The results in MPa were statistically analyzed by two-way ANOVA and Holm–Sidak tests (α=0.05).ResultsThe two-way ANOVA detected no interactions between factors (p=0.865), but only differences between the adhesive systems (p=0.042) and application modes (p=0.014). One Step Plus obtained a higher μSBS than One Step, and vigorous application increased bond strength of adhesives systems. The predominant failure modes of all groups were adhesive-mixed.ConclusionThe adhesive systems showed the best μSBS results with presence of filler and active mode application