Open AccessFormation of subsurface cracks in silicon wafers by grinding
Author(s) -
Jingfei Yin,
Qian Bai,
Yinnan Li,
Bi Zhang
Publication year - 2018
Publication title -
nanotechnology and precision engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.232
H-Index - 12
eISSN - 2589-5540
pISSN - 1672-6030
DOI - 10.1016/j.npe.2018.09.003
Subject(s) - grinding , wafer , materials science , abrasive , cleavage (geology) , silicon , brittleness , semiconductor , composite material , metallurgy , optoelectronics , fracture (geology)
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