Open AccessAu maskless patterning for vacuum packaging using the electrochemical method
Author(s) -
Bo Xie,
Deyong Chen,
Junbo Wang,
Jian Chen,
Wen Hong
Publication year - 2018
Publication title -
nanotechnology and precision engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.232
H-Index - 12
eISSN - 2589-5540
pISSN - 1672-6030
DOI - 10.1016/j.npe.2018.09.001
Subject(s) - interconnection , materials science , wafer , silicon on insulator , optoelectronics , wire bonding , microelectromechanical systems , anode , etching (microfabrication) , anodic bonding , insulator (electricity) , silicon , microelectronics , wafer bonding , stack (abstract data type) , nanotechnology , layer (electronics) , electrical engineering , electrode , computer science , telecommunications , chip , chemistry , engineering , programming language
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