Open AccessAu maskless patterning for vacuum packaging using the electrochemical method
Author(s) -
Bin Xie,
Deyong Chen,
Junbo Wang,
Jian Chen,
Hong Wang
Publication year - 2018
Publication title -
nami jishu yu jingmi gongcheng/nanotechnology and precision engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.232
H-Index - 12
eISSN - 2589-5540
pISSN - 1672-6030
DOI - 10.1016/j.npe.2018.09.001
Subject(s) - interconnection , materials science , wafer , silicon on insulator , optoelectronics , wire bonding , microelectromechanical systems , anode , etching (microfabrication) , insulator (electricity) , silicon , anodic bonding , microelectronics , wafer bonding , nanotechnology , layer (electronics) , electrical engineering , electrode , computer science , telecommunications , chemistry , engineering , chip