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COPII: a membrane coat that forms endoplasmic reticulum‐derived vesicles
Author(s) -
Barlowe Charles
Publication year - 1995
Publication title -
febs letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.593
H-Index - 257
eISSN - 1873-3468
pISSN - 0014-5793
DOI - 10.1016/0014-5793(95)00618-j
Subject(s) - copii , copi , endoplasmic reticulum , vesicle , golgi apparatus , microbiology and biotechnology , budding , clathrin , vesicular transport proteins , biology , gtpase , cytoplasm , membrane , secretory pathway , biochemistry , vacuole , vacuolar protein sorting
Vesicle budding from the endoplasmic reticulum (ER) has been reconstituted with washed membranes and three soluble proteins: Sec13 complex, Sec23 complex and the small GTPase Sar1p. The proteins that drive this cell‐free vesicle budding reaction form an ∼10 nm thick electron dense coat on ER‐derived vesicles. Although the overall mechanism of membrane budding driven by various cytoplasmic coats appears similar, the constituents of this new membrane coat are molecularly distinct from the non‐clathrin coat (COP) involved in intra‐Golgi transport and the clathrin‐containing coats. The new vesicle coat has been termed COPII.