Open AccessMaterial removal mechanism of copper chemical mechanical polishing with different particle sizes based on quasi-continuum method
Author(s) -
Aibin Zhu,
Dayong He,
Shengli He,
Wencheng Luo
Publication year - 2017
Publication title -
friction
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.221
H-Index - 30
eISSN - 2223-7704
pISSN - 2223-7690
DOI - 10.1007/s40544-017-0142-1
Subject(s) - materials science , abrasive , chemical mechanical planarization , polishing , composite material , copper , particle size , particle (ecology) , residual stress , metallurgy , shear band , deformation (meteorology) , shear stress , shear (geology) , chemistry , oceanography , geology