Open AccessDesign Optimization of Pillar Bump Structure for Minimizing the Stress in Brittle Low K Dielectric Material Layer
Author(s) -
Xinjiang Long,
Jintang Shang,
Li Zhang
Publication year - 2019
Publication title -
acta metallurgica sinica (english letters)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.594
H-Index - 33
eISSN - 2194-1289
pISSN - 1006-7191
DOI - 10.1007/s40195-019-00948-6
Subject(s) - materials science , brittleness , flip chip , pillar , soldering , stress (linguistics) , composite material , thermal copper pillar bump , dielectric , undercut , low k dielectric , finite element method , layer (electronics) , structural engineering , optoelectronics , adhesive , engineering , linguistics , philosophy
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