Open AccessCrack Initiation and Propagation Evaluation for Sn–5Sb Solder Under Low-Cycle Fatigue
Author(s) -
Noritake HIYOSHI
Publication year - 2017
Publication title -
acta metallurgica sinica (english letters)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.594
H-Index - 33
eISSN - 2194-1289
pISSN - 1006-7191
DOI - 10.1007/s40195-017-0605-4
Subject(s) - materials science , soldering , crack closure , fracture mechanics , strain (injury) , composite material , melting point , strain rate , metallurgy , medicine
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