Metallurgical Behaviour and Carbon Diffusion in Buttering Deposits Prepared With and Without Buffer Layers
Author(s) -
Dinesh W. Rathod,
Sunil Pandey,
S. Aravindan,
Pavan Kumar Singh
Publication year - 2016
Publication title -
acta metallurgica sinica (english letters)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.594
H-Index - 33
eISSN - 2194-1289
pISSN - 1006-7191
DOI - 10.1007/s40195-016-0487-x
Subject(s) - materials science , inconel , metallurgy , austenite , alloy , buffer (optical fiber) , welding , carbon steel , layer (electronics) , carbon fibers , composite material , composite number , corrosion , microstructure , telecommunications , computer science
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