Open AccessAn Easy Way to Quantify the Adhesion Energy of Nanostructured Cu/X (X = Cr, Ta, Mo, Nb, Zr) Multilayer Films Adherent to Polyimide Substrates
Author(s) -
Kai Wu,
J.Y. Zhang,
Gang Liu,
Jiao Li,
Guojun Zhang,
Jun Sun
Publication year - 2016
Publication title -
acta metallurgica sinica (english letters)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.594
H-Index - 33
eISSN - 2194-1289
pISSN - 1006-7191
DOI - 10.1007/s40195-016-0375-4
Subject(s) - materials science , polyimide , adhesion , copper , ultimate tensile strength , composite material , surface energy , metallurgy , layer (electronics)
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