Open AccessThe effect of Si impurity at the Al Σ5 grain boundary: a first principle computational tensile test study
Author(s) -
Jiuhui Li,
Xing Zhao,
Dongsheng Wang,
Fan-Shun Meng
Publication year - 2013
Publication title -
acta metallurgica sinica (english letters)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.594
H-Index - 33
eISSN - 2194-1289
pISSN - 1006-7191
DOI - 10.1007/s40195-013-0083-2
Subject(s) - materials science , impurity , grain boundary , condensed matter physics , charge (physics) , ultimate tensile strength , covalent bond , stress (linguistics) , density functional theory , tensile testing , fracture (geology) , metallurgy , computational chemistry , composite material , microstructure , chemistry , physics , linguistics , philosophy , organic chemistry , quantum mechanics
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