Premium
Adhesion properties of soy protein with fiber cardboard
Author(s) -
Zhong Zhikai,
Susan Sun X.,
Fang Xiaohua,
Ratto Jo A.
Publication year - 2001
Publication title -
journal of the american oil chemists' society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.512
H-Index - 117
eISSN - 1558-9331
pISSN - 0003-021X
DOI - 10.1007/s11746-001-0216-0
Subject(s) - cardboard , ultimate tensile strength , composite material , materials science , adhesive , shear strength (soil) , fiber , pressing , soy protein , adhesion , chemistry , food science , environmental science , layer (electronics) , soil science , soil water
Adhesion properties of soy protein isolate (SPI) on fiber cardboard and effects of press conditions, pre‐pressing drying time, and protein concentrations on gluing strength were investigated. Shear strength increased as press time, press pressure, and/or press temperature increased. The effect of temperature on shear strength became more significant at high press pressure. The shear strength of the SPI adhesive on fiber cardboard decreased by 12–25% after water soaking. Shear strength increased as pre‐pressing drying time increased and reached its maximal value at about 10 min. An SPI/water ratio of 12∶100 (w/w) gave the highest gluing strength. The specimens showed complete cohesive failure (fiber cardboard failure) except for soaked specimens pressed at low press temperature, low pressure, and short press time. Specimens pressed at 25°C and 2 MPa for 5 min with pre‐pressing drying time of 10 min and an SPI/water ratio of 12∶100 (w/w) had T‐peel strength and tensile bonding strength of 1.15 N/mm and 0.62 MPa, respectively, without water soaking, and 1.11 N/mm and 0.24 MPa, respectively, with water soaking.