Open AccessThermal Conductivity of Thermal Interface Materials Evaluated By a Transient Plane Source Method
Author(s) -
Hsin Wang,
David Ihms,
Scott D. Brandenburg,
James R. Salvador
Publication year - 2019
Publication title -
journal of electronic materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.422
H-Index - 99
eISSN - 1543-186X
pISSN - 0361-5235
DOI - 10.1007/s11664-019-07244-0
Subject(s) - thermal conductivity , thermal grease , materials science , thermal conductivity measurement , thermal resistance , thermal contact conductance , heat transfer , thermal contact , thermoelectric generator , composite material , thermoelectric materials , thermal conduction , thermal effusivity , thermoelectric effect , transient (computer programming) , thermal , mechanics , thermodynamics , computer science , physics , operating system
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