Open AccessCantilever testing of sintered-silver interconnects
Author(s) -
Andrew A. Wereszczak,
Branndon R. Chen,
Osama M. Jadaan,
Brian A. Oistad,
Max C. Modugno,
Jeffrey Sharp,
James R. Salvador
Publication year - 2017
Publication title -
journal of materials science materials in electronics
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.489
H-Index - 75
eISSN - 1573-482X
pISSN - 0957-4522
DOI - 10.1007/s10854-017-8063-3
Subject(s) - materials science , cantilever , interconnection , composite material , shear (geology) , ultimate tensile strength , tensile testing , beam (structure) , direct shear test , silicon , structural engineering , metallurgy , computer science , computer network , engineering
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