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Modification of soy proteins and their adhesive properties on woods
Author(s) -
Kalapathy U.,
Hettiarachchy N. S.,
Myers D.,
Hanna M. A.
Publication year - 1995
Publication title -
journal of the american oil chemists' society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.512
H-Index - 117
eISSN - 1558-9331
pISSN - 0003-021X
DOI - 10.1007/bf02638849
Subject(s) - adhesive , composite material , relative humidity , curing (chemistry) , materials science , glue , humidity , maple , bonding strength , chemistry , shear strength (soil) , soy protein , bond strength , food science , soil water , botany , physics , environmental science , layer (electronics) , biology , soil science , thermodynamics
Adhesive properties of trypsin‐modified soy proteins (TMSP) on woods were investigated. A simple method developed in our laboratory, consisting of measuring the force required to shear the bond between glued wood pieces in the Instron universal testing machine, was used to examine adhesive strength of modified soy proteins on wood. Adhesive strength of TMSP was measured for cold‐pressed (ambient temperature for 2 h) and hot‐pressed (60, 80, 100, and 120°C for times varying from 0.5 to 2.5 h) woods. Of the woods examined, soft maple gave the highest strength [743 Newtons (N) at a protein glue concentration of 2 mg/cm 2 ]. For soft maple and cold‐pressing, TMSP at 2 mg/cm 2 gave twice the adhesive strength of unmodified protein controls, 743 vs. 340 N. Also, the adhesive strength of TMSP increased from 284 to 743 N as glue concentration was increased from 1 to 2 mg/cm 2 . However, hot‐pressing of wood pieces beyond 1 h at 120°C and 30% relative humidity resulted in decreased adhesive strengths of TMSP compared to controls. Further, adhesive strengths of hot‐pressed glued wood samples decreased when the relative humidity at which they were kept for curing increased from 30 to 60%. This negative effect of increased humidity on adhesive strengths of glued wood pieces was not observed with cold‐pressed TMSP.