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C‐19 diacid‐based polyamides
Author(s) -
Lawson N. E.,
Cheng T. T.
Publication year - 1982
Publication title -
journal of the american oil chemists' society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.512
H-Index - 117
eISSN - 1558-9331
pISSN - 0003-021X
DOI - 10.1007/bf02636321
Subject(s) - polyamide , polymer chemistry , materials science , hydroformylation , adhesive , dimer , dicarboxylic acid , polymer science , chemistry , organic chemistry , composite material , rhodium , catalysis , layer (electronics)
The preparation and properties of polyamide hot‐melt adhesives derived from Koch C‐19 diacid are described. They are comparable to those of commercial C‐36 dimer acid‐based polyamides for bonding leather and metals and somewhat superior to those of polyamides made from C‐19 diacid derived from a hydroformylation process.