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Resins from hydroxyphenylstearic acid
Author(s) -
Scholnick F.,
Monroe H. A.,
Wrigley A. N.,
Ault W. C.
Publication year - 1965
Publication title -
journal of the american oil chemists' society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.512
H-Index - 117
eISSN - 1558-9331
pISSN - 0003-021X
DOI - 10.1007/bf02558246
Subject(s) - formaldehyde , phenol , epoxy , oleic acid , catalysis , chemistry , organic chemistry , polymer chemistry , nuclear chemistry , materials science , biochemistry
Hydroxyphenylstearic acid, prepared by addition of phenol to oleic acid, has been condensed with excess formaldehyde using acidic and alkaline catalysts. The resulting resins have mol wt corresponding to 2舑3 phenolic units and are readily soluble in alcohols. Films cast from these solutions are soft even after baking at 205C. In order to achieve greater hardness, solutions of the phenol‐formaldehyde resins were coreacted with a solution of a commercial epoxy resin. Baked films cast from these systems were hard, flexible and chemically resistant.